ERS Electronic Opens Advanced Packaging Facility in Germany 🚀

ERS electronic has inaugurated a state-of-the-art production and R&D plant near Regensburg, Germany, focused on advanced packaging and backend technologies. The ERS Barbing site integrates manufacturing, research, and a Competence Centre, providing hands-on expertise in wafer and panel debonding, warpage handling, and thermal management. CEO Laurent Giai-Miniet emphasized the company’s commitment to accelerating semiconductor innovation, while Site Manager Imre Kosa highlighted the benefits of combining production and R&D under one roof. The facility aims to enhance industry collaboration and optimize manufacturing processes in Europe and beyond.